Cadence's laser ablation process is used in microfabrication to selectively remove material from a solid substrate through laser pulses.
These short, laser beam pulses are controlled in a manner that removes material from a solid (or occasionally liquid) surface so quickly that the surrounding material absorbs very little heat, preventing thermal distortion in the base material.
Benefits of using laser ablation:
- High precision tolerances
- Fine surface finishes
- 3-dimensional ablating of PEEK for implants
- The material removal rate is controlled at the nanometer scale
- End result material is virtually burr-free
- Channel machining for microfluidic devices
- Removing polyimide or parylene coating for catheters and guidewires
- Small beam diameter provides increased flexibility in designs of microstructures and other engineered surfaces
- Marking fiducials or data metric codes on semiconductor wafers
- Removing dielectric cover material to expose electrodes
- No consumable tooling costs for electrodes, wire, or cutters
Contact us today to learn more about how we can provide the required laser ablation and coating removal solutions for your applications!
